Category
NANIUM S.A., a leading provider of advanced semiconductor packaging
known for its innovative solutions, today announced it achieved outstanding
reliability results for a Wafer-Level Chip Scale Package (WLCSP) without the
typically applied Under Bump Metallization (UBM). The product, with a package of
5.8 x 5.4 mm2, endured over 1,000 TCoB, a reliability milestone for a UBM-less
WLCSP package that reflects the company's know-how in both WLCSP and Wafer-Level
Fan-Out (WLFO) technologies.
"This is a remarkable achievement that reflects the intense
development work we have been carrying out at NANIUM", explained Vitor Chatinho,
NANIUM's senior integration engineer responsible for the project. "The
reliability results we achieved without UBM translate into a shorter
manufacturing cycle time of the products, as well as a clear cost advantage.
This is an outbreak that positions WLCSP technology as one the most
cost-efficient in the market without reliability compromise."
NANIUM was among the first in the world to offer WLFO in high volume
manufacturing and, indeed, the company's expertise in WLFO process were key to
the development of this solution. This new qualified solution required a
thorough knowledge and fine-tuning of WLCSP material characteristics and package
design, something that the company had already attained upon their work for
qualifying the world's largest WLCSP package in 2014.
The new WLCSP packages, developed for a product in the mobile
market, are an optimal configured combination of material, process and design
elements. They have exceeded 1,000 cycles in the temperature cycling on board
test (TCoB @ -40 to 125 degrees C), performed according to IPC-9701 (condition
TC3) standard, while also exceeding 200 drops in the Board Level Drop Test
performed according to the JEDEC JESD22-B111 standard. These results were
considered excellent, as UBM generally is an essential element in the package
construction of WLCSP to achieve these reliability levels.
WLCSP is a Fan-In technology that offers the highest
electrical/thermal performance, as well as the smallest package form-factor
possible in the semiconductor packaging industry. It enables low-cost
manufacturing for product applications such as Mobile and Consumer products,
Wireless connectivity, MEMS and Sensors.
NANIUM will be showcasing this WLCSP solution at Semicon West, along
with its other wafer-level packaging technology innovations. The event will be
held in San Francisco, California, USA, from July 14th to July 16th, 2015.