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Packaging and testing firm ChipMOS Technologies will allocate 30-40% of its planned capex for 2015 for upgrading its production lines for LCD driver ICs, according to the company.
Meanwhile, around 20% of ChipMOS' 2015 capex will be use to expand capacity for 12-inch wafer bumping, said the company. ChipMOS is looking to grow its capacity for 12-inch wafer bumping to 40,000-50,000 units monthly.
In addition, with DDR4 memory demanding flip-chip (FC) packaging technology, ChipMOS will expand FC packaging lines in 2015, the company added.
ChipMOS plans to budget around US$115 million in capex for 2015, the company disclosed.
Market watchers expect ChipMOS to see its quarterly revenues register sequential growth through the last quarter of 2015, thanks to strong orders for LCD driver ICs and steady growth in demand for memory chips. ChipMOS is forecast to generate a 7-8% revenue increase in 2015.
ChipMOS specializes in backend services for LCD driver ICs and memory chips, as well as mixed-signal ICs such as fingerprint sensors and power management chips.